Semiconductor Company Launches New Product, Continues to Grow Business

siXis’ existing investors, RTI International and venture capital firm Intersouth Partners, both participated in the round of financing. The investment will be used to support ongoing product development. The company recently announced the launch of the SX2000 Reconfigurable Computing Platform, a scalable, high-performance platform designed to streamline and accelerate data-intensive applications.

The company’s SiCB technology platform allows bare die integrated circuits to be densely populated onto a large area silicon substrate, replacing the current method of putting packaged die onto a conventional printed circuit board. As compared to these traditional electronic assemblies, this breakthrough platform allows a smaller overall system to deliver higher functionality and performance with reduced power requirements, due to fewer signal discontinuities and shorter traces between die.

“We’re pleased to have the continued support of our investors,” said John Goehrke, President and CEO of siXis, Inc. “With the recent launch of the SX2000 and the upcoming launch of our line of next-generation embedded computing modules, their support is critical to the continued growth of the company.”

siXis will be exhibiting at SC09, an international conference for high-performance computing, networking, storage and analysis in Portland, Oregon from November 14-20. The company will be demonstrating the SX2000, and introducing its first embedded computing modules at the conference in booth #2285.